Patent · US Active

Temporary adhesion of chemically similar substrates

US9034139B2 · kind B2 · utility

4Cited by

4References

4Claims

0Family size

Assignee

Wacker Chemie AG · DE

Inventors

Andreas Koellnberger · Haag in Oberbayern, DE
Frank Achenbach · Simbach, DE

Key dates

Filing date	Jul 11, 2012
Grant date	May 19, 2015
Priority date	—
Expiry date	Jul 11, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/6834
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A temporary adhesive for reversibly bonding a silicon wafer to a silicon support contains a crosslinkable organopolysiloxanes composition and a fatty acid or salt thereof or fatty acid ester as a release regulator having a density different from the crosslinkable organopolysiloxanes composition of at least 0.1 g/cm3, which upon parting of the wafer from the substrate, the adhesive remains substantially adhered to the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.