Semiconductor device and method for manufacturing same
US9035438B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2014 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Jan 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present specification relates to a semiconductor device in which a metal plate is attached onto a surface of a resin package, and provides a structure in which the metal plate is not easy to separate. The semiconductor device disclosed in the present specification includes semiconductor chips (IGBT, diode), a resin package molding the semiconductor chips, and metal plates fixed onto the surface of the resin package. An anchoring member is bridged between two points on a back face of the metal plate. A space between one of the metal plates and the anchoring member is filled with a molding resin of the resin package. The anchoring member firmly bites the resin package, and therefore, the metal plate is difficult to be released from the resin package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.