Determining layer thickness

US9035665B2 · kind B2 · utility

Assignee

• PLASTIC LOGIC LIMITED · GB

Inventor

• Stephan Riedel · Frankfurt am Main, DE

Key dates

• Filing date: Jun 3, 2011
• Grant date: May 19, 2015
• Expiry date: Dec 24, 2031

Classification

• Technology area (CPC G): Physics
• CPC primary: G01B7/06
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A technique comprising: producing a plurality of devices according to a common production process; and determining the thickness of a layer of one of said plurality of devices using an indicator of a first electrical property dependent on the area of overlap between a first element of the device and a second element of the device partially underlying said first element via said layer, wherein the method further comprises: additionally using an indicator of a second electrical property dependent on the area of overlap between said first element of the device and a third element of the device also partially underlying said first element via said layer, wherein (a) the difference between (i) a measured indicator of said first electrical property, and (ii) a measured indicator of said second electrical property provides a more reliable indicator of the thickness of said layer than (b) an indicator of said first electrical property.