Heat sink thermal press for phase change heat sink material
US9036354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2013 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Aug 19, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.