Circuit board with signal layers of different dimensions to communicate signals of different frequencies
US9036364B1 · kind B1 · utility
5Cited by
4References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 2007 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Dec 16, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09972
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic devices to output signals at different frequencies are mounted to a circuit board that has a group of layers, where the group of layers include reference plane layers and signal layers between the reference plane layers. A first signal layer has conductive traces having a first dimension to communicate the signals at a first frequency, and a second signal layer has conductive traces having a second, different dimension to communicate signals at a second, different frequency. The first and second signal layers are successive layers without any reference plane layer in between the first and second signal layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.