Method of forming thin resistive heating layer, heating member including the thin resistive heating layer, and fusing unit including the heating member
US9037063B2 · kind B2 · utility
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6References
20Claims
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Key dates
| Filing date | Jun 28, 2013 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Jul 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a thin film resistive heating layer, the method including: forming a polymer layer by extruding a polymer paste, in which an electrically conductive filler is dispersed, by using an extrusion molding operation, on an outer circumferential surface of a cylindrical member; and forming a thin film resistive heating layer by making an outer diameter of the polymer layer uniform by using a ring blading operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.