Patent · US Active

Thickness shear mode resonator sensors and methods of forming a plurality of resonator sensors

US9038263B2 · kind B2 · utility

1Cited by

51References

14Claims

0Family size

Assignee

Delaware Capital Formation, Inc. · US

Inventors

Derek Puccio · Cottonwood Heights, US
Errol P. EerNisse · Salt Lake City, US

Key dates

Filing date	Jan 13, 2012
Grant date	May 26, 2015
Priority date	—
Expiry date	Jun 1, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4908
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.