Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
US9038998B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 16, 2010 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Sep 17, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.