Mold structure and bumper
US9039052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2010 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Oct 18, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60R2019/1886
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold structure used to form a molded object having an undercut portion includes a fixed mold as a first mold having a first molding surface for molding an obverse surface of the molded object; a slide core having an undercut molding surface used to mold the undercut portion as part of the obverse surface of the molded object; and a movable mold as a second mold having a second molding surface used to mold the reverse surface of the molded object. The first molding surface and the undercut molding surface form a cavity surface. A step is formed between the first molding surface and the second molding surface at a parting position between the fixed mold and the slide core on the cavity surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.