Electronic interconnect devices having conductive vias
US9039448B2 · kind B2 · utility
18Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2013 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Mar 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6585
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic interconnect device includes a substrate having a first surface and a second surface. The substrate has a plurality of openings extending between the first and second surfaces. Each opening has a conductive outer via, an insulative barrier and a conductive inner via. The outer via, insulative barrier and inner via are concentric within the opening such that the insulating barrier is disposed between the conductive inner via and the conductive outer via. The conductive inner via is configured to receive a conductor to be inserted therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.