Enclosed polishing apparatus
US9039492B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 30, 2013 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | May 6, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B47/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An enclosed polishing apparatus include a housing, a fixing seat, a guiding mechanism, and a chain-driven polishing mechanism. The housing includes a bottom housing and a top housing connected to the bottom housing. The fixing seat is securely placed in the bottom housing. The guiding mechanism is placed in the top housing above the fixing seat. The polishing mechanism is movably mounted on the guiding mechanism above the fixing seat. The polishing mechanism is driven and guided by the guiding mechanism to follow a desired polishing contour on a workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.