Patent · US Active

Bonding using hot-melt adhesives

US9039862B2 · kind B2 · utility

2Cited by

5References

22Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Juergen Lotz · Kiedrich, DE
Dirk Kasper · Goldkronach, DE
Lutz Pielert · Erfurt, DE

Key dates

Filing date	Mar 11, 2013
Grant date	May 26, 2015
Priority date	—
Expiry date	Mar 11, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2826
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to the use of a hot-melt adhesive having high hardness for adhesive bonding of metal films or foils, paper films or foils, and/or plastic films or foils. The invention further relates to a method for adhesively bonding a metal film or foil, paper film or foil, and/or plastic film or foil onto a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.