Silicon substrate optimization for microarray technology
US9039996B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2011 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Nov 2, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A micro device includes a substrate and a structure configured to bind to an object or a material, or not to bind to an object or material. The structure has a roughness based on a roughness of the object or material. For example, a microarray includes a substrate and a well positioned in the substrate and configured to bind to a type of bead. The well has a roughness based on a roughness of the type of bead to which the well is configured to bind. The roughness of the well is controlled by controlling a position and number of striations in the side of the well. In another example, a moveable component of a micro device may have a roughness different from a roughness of an adjacent component, to reduce the likelihood of the moveable component sticking to the adjacent component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.