Lamination as a modular approach for building organic photosensitive devices
US9040318B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2011 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Apr 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
There is disclosed a modular lamination approach for processing organic photosensitive devices that allows the individual processing of device components, that once processed are brought together in a final step to make electrical contact. The disclosed method of preparing a laminated photosensitive device having at least one donor-acceptor heterojunction comprises: preparing a top electrode by depositing a functional material on a flexible substrate, such as an elastomer; optionally processing the functional material to obtain desired properties prior to lamination; preparing a bottom portion by depositing a second functional material over a substrate; optionally processing the second functional material to obtain desired properties prior to lamination; and coupling the top electrode to said bottom portion to form a laminated photosensitive device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.