Carbon nanotube devices with unzipped low-resistance contacts
US9040364B2 · kind B2 · utility
14Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2012 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Jan 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of creating a semiconductor device is disclosed. An end of a carbon nanotube is unzipped to provide a substantially flat surface. A contact of the semiconductor device is formed. The substantially flat surface of the carbon nanotube is coupled to the contact to create the semiconductor device. An energy gap in the unzipped end of the carbon nanotube may be less than an energy gap in a region of the carbon nanotube outside of the unzipped end region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.