Patent · US Active

Process for producing a hole using different laser positions

US9040871B2 · kind B2 · utility

1Cited by

5References

21Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Jan Münzer · Berlin, DE
Thomas Podgorski · Oranienburg, DE

Key dates

Filing date	Aug 12, 2010
Grant date	May 26, 2015
Priority date	—
Expiry date	Nov 21, 2031

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/0622
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Methods for producing a continuous hole in a substrate are provided. A laser is used for producing an inner proportion and a diffuser of the continuous hole, wherein an angular position of the laser with respect to the substrate is changed at least three times.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.