Multilayered circuit type antenna package
US9041074B2 · kind B2 · utility
8Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2012 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Jun 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.