Laminate interconnect having a coaxial via structure
US9041208B2 · kind B2 · utility
2Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2011 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Sep 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laminate interconnect structure includes a core material and at least one additional layer adjacent the core material, a first electrically conductive via formed in the core material, and a second electrically conductive via formed in the core material, coaxial with the first electrically conductive via and separated from the first electrically conductive via by a non-conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.