Method for producing a solder joint
US9041224B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2012 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Sep 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a solder joint between at least one base part (2) and at least one first component (3) includes the following steps: providing the base part (2); partially blasting a surface of the base part (2) using a SACO blasting agent, the blasting material (50) of which has a silicate coating (52), in such a way that a SACO-blasted region (20) and a non-blasted positioning region (40) are present; and soldering the at least first component (3) onto the non-blasted positioning region (40), wherein the SACO-blasted region (20) acts as a solder resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.