Thermal management of a communication transceiver in an electrical communication device
US9042096B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2013 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Jan 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q1/118
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are various systems and methods relating to communication devices that include modular transceivers, such as small form pluggable transceivers. According to one embodiment, a communication device may include a chassis defining an interior and an exterior of the communication device. The chassis includes a top, a bottom, and a plurality of sides that together with the top and the bottom form an enclosure. One of the sides may include a first segment disposed in a first plane and a second segment disposed in a second plane. The second segment includes an outwardly extending communication transceiver housing configured to receive a communication transceiver. The communication transceiver may extend through an aperture in the second segment and into interior of the communication device to contact an electrical connector, while a second portion of the communication transceiver in the communication transceiver housing remains on the exterior of the communication device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.