System and method for cooling heat generating components
US9042100B2 · kind B2 · utility
13Cited by
7References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Jan 23, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.