Thin film type chip device and method for manufacturing the same
US9042106B2 · kind B2 · utility
4Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2013 |
| Grant date | May 26, 2015 |
| Priority date | — |
| Expiry date | Nov 12, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.