Noble metal surface treatment to improve adhesion in bio-compatible devices
US9044200B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2013 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Dec 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method involving forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer, wherein the first bio-compatible layer defines a first side of a bio-compatible device; forming a conductive pattern on the first bio-compatible layer, the conductive pattern comprising a metal; mounting an electronic component to the conductive pattern; forming a self-assembled monolayer (SAM) on the conductive pattern by contacting the conductive pattern with a functionalized sulfur compound or a functionalized selenium compound; forming an adhesion layer on the SAM by contacting the SAM with an adhesion promoter; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern having the adhesion layer, wherein the second bio-compatible layer defines a second side of the bio-compatible device; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a s…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.