Method of cladding diamond seeds
US9044726B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2006 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Dec 30, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01J2203/068
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention relates to a method for manufacture of diamond, the method including the steps of providing a first coating of solvent metal or solvent metal alloy on a diamond seed to create a coated diamond seed, situating the coated diamond seed adjacent a catalyst system comprising a solvent metal and/or a source of carbon, and subjecting the coated diamond seed and catalyst system to increased temperature wherein the melting point of the first coating is at least 20 deg C. below that of the catalyst system. The invention further relates to a compact comprising a plurality of diamond seeds wherein at least one seed includes a first coating comprising a solvent metal and/or solvent metal based alloy, the compact further comprising a catalyst system comprising a solvent metal and/or a source of carbon wherein the melting point of the first coating is at least 20 deg C. below that of the catalyst system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.