Transient liquid phase bonding process for double sided power modules
US9044822B2 · kind B2 · utility
2Cited by
71References
20Claims
0Family size
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Key dates
| Filing date | Aug 1, 2013 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Jan 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A double-sided bonding process using transient liquid phase (TLP) bonding structure. A first side of an electronic device is processed to partially complete bonding. A second side of the electronic device is processed to complete bonding. The first side completes bonding during the processing of the second side. This reduces the time needed for the bonding process of both sides. This process allows for various TLP bonding parameters while being compatible with conventional fabrication systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.