Thermal sensing fluid ejection assembly and method
US9044942B2 · kind B2 · utility
1Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2010 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Sep 30, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14153
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid ejection assembly includes a fluid slot formed in a die. The assembly also includes a nozzle column is formed along a side of the fluid slot. The assembly also includes a pair of thermal sensors to measure die temperature at the middle of the nozzle column and at a first end of the nozzle column.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.