Floor-to-ceiling partition wall assembly
US9045896B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2013 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Nov 23, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T292/096
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A panel wall system includes a frame assembly adapted to support a plurality of skin assemblies in a floor-to-ceiling relationship, wherein the skin assemblies include solid panel assemblies as well as captured glass skin assemblies. The solid panel assemblies are coupled to the frame assembly with seal members disposed between the panel assemblies and the frame assembly. The seal members are unitary seal members able to seal adjacent panel assemblies on the frame assembly. The seal members further include pierceable body portions that can be pierced by various engagement structures to engage the frame assembly through the seal member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.