Method for selectively treating surfaces
US9046684B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2012 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Oct 25, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/20
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of treating a surface includes providing an object and applying a masking layer to a target surface area of the object. A sacrificial material is applied to a non-target surface area of the object. The method also includes removing the masking layer from the target surface area. The target surface area is exposed to a substance that etches or coats the target surface area. The sacrificial material from the non-target surface area of the object is removed, leaving the target surface area of the object etched or coated by the substance while the non-target surface area is not etched or coated by the substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.