Light transmissive mold and apparatus for imprinting a pattern onto a material applied on a semiconductor workpiece and related methods
US9046793B2 · kind B2 · utility
6Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2011 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Jun 6, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7076
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A light transmissive mold used for imprinting a pattern onto a material applied on a semiconductor workpiece. The mold includes a first surface having an area of a pattern to be imprinted onto the material, a second surface located opposite from the first surface, and a third surface disposed between the first surface and the second surface, at a position inwardly away from the first surface. The third surface is arranged opposite to an area of the workpiece subjected to dicing. An alignment structure, provided for alignment between the mold and the workpiece, is formed in the third surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.