Package with integrated pre-match circuit and harmonic suppression
US9048232B2 · kind B2 · utility
4Cited by
12References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2012 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Oct 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09781
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package is connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit to provide an impedance match for a signal to be sent to a circuit external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.