Optoelectronic component

US9048393B2 · kind B2 · utility

Assignees

• OSRAM Opto Semiconductors GmbH · DE
• Heraeus Materials Technology GmbH & Co. KG · DE

Inventors

• Michael Zitzlsperger · Regensburg, DE
• Eckhard Ditzel · Gelnhausen, DE
• Jörg Erich Sorg · Regensburg, DE

Key dates

• Filing date: May 28, 2010
• Grant date: Jun 2, 2015
• Expiry date: Dec 18, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/831

Abstract

An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.