Light emitting diode package with oxidation-resistant metal coating layer

US9048394B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• HOU-TE LIN · Hsinchu, TW
• CHAO-HSIUNG CHANG · Hsinchu, TW
• PIN-CHUAN CHEN · Hsinchu, TW
• LUNG-HSIN CHEN · Hsinchu, TW

Key dates

• Filing date: Nov 12, 2013
• Grant date: Jun 2, 2015
• Expiry date: Nov 12, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/856

Abstract

An exemplary light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, and an LED die mounted on a top surface of the substrate. The substrate also includes a bottom surface. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. An oxidation-resistant metal coating layer is formed on a top face of each of the first and second electrodes. The LED die is electrically connected to the first and second electrodes via the two oxidation-resistant metal coating layers.