Light emitting diode package

US9048408B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• HOU-TE LIN · Hsinchu, TW
• PIN-CHUAN CHEN · Hsinchu, TW
• LUNG-HSIN CHEN · Hsinchu, TW

Key dates

• Filing date: Nov 12, 2013
• Grant date: Jun 2, 2015
• Expiry date: Nov 12, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.