Integrated drive-motor assembly with IP seal and enhanced heat transfer
US9048708B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2012 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Oct 27, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K11/33
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronics drive module is connected to the flange of a drive motor assembly. The module includes: a metal frame including a peripheral wall; and a metal floor. A power supply PCBA is located adjacent the upper surface of the metal floor, and a switching chip assembly is located adjacent the lower surface of the floor. The base plate of the switching chip assembly conducts heat into the floor and conducts heat into the mounting flange. An environmental seal is located between the lower edge of the frame and the sealing surface of the mounting flange and extending coextensively with the lower edge of the peripheral wall such that a sealing zone is defined within the peripheral wall of the frame and the first and second thermal interfaces are located within the sealing zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.