Polyamic acid, photosensitive resin composition, dry film and circuit board
US9049778B2 · kind B2 · utility
1Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2012 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Mar 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.