Thermally-conductive particles in printed wiring boards
US9049805B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2012 |
| Grant date | Jun 2, 2015 |
| Priority date | — |
| Expiry date | Mar 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board (PWB) can be fabricated with enhanced thermal characteristics that can enable the use of higher performance electronic components and/or a smaller packaging configuration. A substrate layer of the PWB includes a matrix material and optional reinforcing fibers embedded in the matrix material. The matrix material and/or the reinforcing fibers may include thermally-conductive particles such as nanodiamonds that increase the thermal conductivity of the substrate layer. Holes may be formed through the substrate layer for receiving and/or electrically connecting electronic components. The thermally-conductive particles are sized sufficiently small to allow the formation of the holes through the substrate layer using conventional equipment and processes such as drilling. The PWB may also include a protective coating that comprises thermally-conductive particles. The thermally-conductive particles described herein can reduce the need for heavy and bulky metal thermal layers in a manufacturing-friendly manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.