Patent · US Active

Method of forming a cutting line partially through a multilayer plate structure

US9050732B2 · kind B2 · utility

0Cited by

5References

12Claims

0Family size

Assignee

TRELLEBORG SEALING SOLUTIONS KALMAR AB · SE

Inventors

Jonas Andersson · Kalmar, SE
Pierre Josefsson · Kalmar, SE

Key dates

Filing date	Dec 23, 2009
Grant date	Jun 9, 2015
Priority date	—
Expiry date	Oct 9, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24612
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A cutting line partially through a multilayer plate structure (1) comprising at least one rigid layer (6, 7) attached to a non-rigid layer (5) is formed by punching in one operation a cutting edge (15) through at least the rigid layer (6) the leaving at least one layer (7) of the multilayer plate structure (1) uncut. During the cutting operation, the rigid layer is gripped by lateral position retaining means (16) to prevent lateral movement of the rigid layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.