Method and apparatus for tile cutting
US9050738B2 · kind B2 · utility
0Cited by
22References
9Claims
0Family size
Inventors
Key dates
| Filing date | Feb 4, 2014 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Feb 4, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D7/043
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for cutting rigid, brittle articles such as tile used as a building material is improved by the capability to make both straight and curved cuts in tile on a single machine. The machine has both circular and plunge cutting tools and a table for moving the tile in both curved and straight lines in relation to the cutting tool, thereby achieving both curved and straight cuts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.