Process for producing a curved substrate covered with a film
US9050755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2012 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Jun 12, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/0016
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for producing a curved substrate (20) covered with a film (10) comprises a heat treatment of the film performed between a step of preforming said film and a step of assembling the film with the substrate. A maximum temperature of the pre-assembling heat treatment is higher than another maximum temperature of a post-assembling heat treatment (F) which is performed after the assembling step. Then the assembly of the substrate (20) with the film (10) is not altered during said post-assembling heat treatment. In particular, no defect and no delamination appear, and no change in the curved shape of the substrate is caused by the post-assembling heat treatment, even if the substrate (20) has a low glass transition temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.