Epoxy resins with high thermal stability and toughness
US9051415B2 · kind B2 · utility
2Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 4, 2012 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | May 4, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/621
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy resin compositions contain (i) a potyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or a mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.