Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4′diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance
US9051430B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 15, 2012 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Mar 15, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more.In the formula, R1 and R2 are a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of R1 and R2 is the aromatic hydrocarbon group having 6 to 10 carbon atoms; R3 is an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, Ras are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.