In-situ sputtering apparatus
US9051638B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 1, 2013 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Mar 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32669
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sputtering apparatus that includes at least a target presented as an inner surface of a confinement structure, the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage supporting the cathode and communicating with the target is preferably provided, and a cable bundle interacting with the cathode and linked to a cable bundle take up mechanism provided power and coolant to the cathode, magnetron, actuator and an anode of the sputtering apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.