Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding
US9054115B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2011 |
| Grant date | Jun 9, 2015 |
| Priority date | — |
| Expiry date | Oct 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.