Patent · US Active

Method for the wafer-level integration of shape memory alloy wires

US9054224B2 · kind B2 · utility

2Cited by

3References

20Claims

0Family size

Assignee

Senseair AB · SE

Inventors

Stefan Braun · Blankenloch, DE
Frank Niklaus · Täby, SE
Andreas Fischer · Castro Valley, US
Henrik Gradin · Sollentuna, SE

Key dates

Filing date	Nov 22, 2011
Grant date	Jun 9, 2015
Priority date	—
Expiry date	Nov 22, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.