Flexible circuit seal
US9056470B2 · kind B2 · utility
0Cited by
10References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2008 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Jun 12, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14362
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Various embodiments and methods relating to an adhesive paste layer (34, 134) sandwiched between a flexible circuit (30) and a fluid delivery system (26) to form a seal at least partially about a print head (28) are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.