Patent · US Active

Embossing apparatus

US9056520B2 · kind B2 · utility

2Cited by

6References

19Claims

0Family size

Assignee

Hewlett-Packard Indigo B.V. · NL

Inventors

Zvika Cohen · Nes Ziona, IL
Eyal Peleg · Yafia, IL
Shahar Stein · Nes Ziona, IL
Itzik Shaul · Nes Ziona, IL

Key dates

Filing date	Jan 31, 2012
Grant date	Jun 16, 2015
Priority date	—
Expiry date	Jun 12, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41M3/16
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

An embossing apparatus comprises an embossing die comprising a printed relief pattern, and a resilient surface for pressing media against the embossing die to emboss features corresponding to the printed relief pattern on the media, in which the printed relief pattern comprises a number of layers of a deposited material, and in which a number of layers of the deposited material closest to the top of the printed relief pattern comprises a deposited material with a relatively lower coefficient of adhesion than layers of the deposited material disposed under the deposited material closest to the top of the printed relief pattern. A printed relief pattern for embossing media comprises a number of preliminary layers, the preliminary layers comprising a first material, and a number of terminal layers, the terminal layers comprising a second material, in which the second material has a lower adhesive coefficient than the first material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.