Semiconductor package and manufacturing method thereof
US9056765B2 · kind B2 · utility
0Cited by
15References
20Claims
0Family size
Inventors
Key dates
| Filing date | Jul 9, 2013 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Jul 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various aspects of the present invention, for example and without limitation, comprise a semiconductor device package and/or method for manufacturing a semiconductor device package. Such a device package may, for example, comprise a MEMS device package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.