Additive for molding of ceramic material
US9056800B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2011 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Sep 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/12
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to an additive for use in the molding of a ceramic material, which exhibits satisfactory water absorption performance in a ceramic green ceramic clay, can highly achieve both high fluidability and low loading performance during extrusion molding and high shape-retaining performance after extrusion at the same time, and comprises polymer microparticles. This additive for use in the molding of a ceramic material comprises polymer microparticles, is characterized in that the polymer microparticles have an average particle size between 10 and 150 μm when the polymer microparticles are swollen with ion exchange water until the swollen polymer microparticles reach a saturated state and can absorb 10-60 mL/g of ion exchange water under ordinary pressure, and is also characterized in that an aqueous dispersion prepared by dispersing 1 part by mass of the polymer microparticles in 110 parts by mass of ion exchange water has an electrical conductivity of 1500 μS/cm or less at 25° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.