Plated resin molded articles
US9057127B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 16, 2005 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Dec 12, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/2086
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a plated resin molded article having a high adhering strength of a plating layer. Specifically, it provides a plated resin molded article that has a metal plating layer on the surface of a thermoplastic resin molded article comprising a composition that contains(A) 10 to 90 mass % of a matrix resin that has a water absorption after 24 hours in 23° C. water (ISO62) of at least 0.6% and(B) 90 to 10 mass % of a non-styrenic resin that has a water absorption after 24 hours in 23° C. water (ISO62) of less than 0.6%, wherein the thermoplastic resin molded article is not subjected to etching with a heavy metal-containing acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.