Vacuum trap
US9057388B2 · kind B2 · utility
365Cited by
17References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2012 |
| Grant date | Jun 16, 2015 |
| Priority date | — |
| Expiry date | Dec 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/1825
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vacuum trap, a plasma etch system using the vacuum trap and a method of cleaning the vacuum trap. The vacuum trap includes a baffle housing; and a removable baffle assembly disposed in the baffle housing, the baffle assembly comprising a set of baffle plates, the baffle plates spaced along a support rod from a first baffle plate to a last baffle plate, the baffle plates alternately disposed above and below the support rod and alternately disposed in an upper region and a lower region of the baffle housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.